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杨道国 教授 (daoguo_yang@163.com)    

桂林电子科技大学    

研究领域:微电子封装组装技术及可靠性、半导体照明封装与系统集成、电子封装组装设备、智能机器人

个人简介

        杨道国,男,获荷兰代尔夫特理工大学博士学位,并在该校精密和微系统工程系从事2年博士后研究;随后在荷兰飞利浦半导体公司总部担任主任工程师(Principal Engineer)和资深项目主管多年。旅居荷兰10年,2009年作为海外高层次人才引进回国工作。

        现任桂林电子科技大学机电工程学院教授、院长,北京邮电大学兼职博导和荷兰代尔夫特理工大学副博导。2011年被聘为广西区政府首批特聘专家,2010年被聘为广西高校“八桂学者”和人才小高地“机械电子工程”创新团队负责人。长期从事微电子封装组装技术、半导体照明封装与系统集成、电子可靠性、电子封装组装与智能化监测设备,以及智能机器人和脑神经工程(新型脑机界面)等方面的研究工作,研究领域包括微电子封装技术、LED封装系统集成及可靠性、热-机械等多物理场耦合仿真分析及其优化设计、微电子力学、新型脑机界面等;主持了4项国家自然科学基金项目,承担国家科技支撑计划重点项目1项,主持国际合作项目5项,省部级项目4项;在荷兰工作期间,主持Philips(NXP)公司研发项目9项,作为核心成员参加欧盟大型研究项目3项(其中欧盟第7框架项目1项,欧盟第6框架项目1项,欧盟ENIAC项目1项)。在本学科领域的国际国内权威刊物发表论文180余篇,其中SCI检索60余篇,EI检索95篇,发表的论文被他引400余次,出版外文专著3部,获得欧洲和美国发明专利3项,国家发明专利3项,获省科技奖3项。多次被邀请在国际学术会议上作特邀报告。担任国家“十二五”863计划“高效半导体照明关键材料技术研发”重大项目课题评审专家;担任第13届 (2012年)国际电子封装技术大会(ICEPT-HDP2012)技术委员会主席,担任IEEE国际年会EuroSimE国际学术会议学术委员会成员,邀请在EuroSimE国际学术会议担任分会主席和共同主席(Co-chair),担任2nd International Conference on Manufacturing  Science and Engineering (ICMSE 2011) 共同主席。是中国电子学会电子制造与封装技术分会理事,第8--10届中国国际半导体照明论坛(CHINASSL)技术委员会委员,《微纳电子技术》理事会副理事长,《半导体技术》理事会理事。担任IEEE Transactions on Components  and Packaging Technologies、 IEEE Transactions on Advanced Packaging、Microelectronics Reliability、Journal of Composite Materials等国际权威杂志的审稿人。多次被荷兰荷兰代尔夫特理工大学等国外知名大学邀请作为博士学位答辩委员会委员。

教育背景
  • 2000年-2003年,荷兰代尔夫特理工大学(Delft University of Technology),机械、海洋和材料(3mE)工程学院,精密和微系统工程系,博士研究生,获博士学位,研究方向:微电子及微系统封装技术及可靠性,导师:Prof.  L.J. Ernst。
  • 1986年-1989年,浙江大学,工程力学系,硕士研究生,获工学硕士学位,研究方向:实验固体力学。
  • 1979年-1983年,广西农学院,农机系农业机械专业,本科,获工学学士学位。

工作经历
  • 2009.9- 现在: 机电工程学院教授,院长。
  • 2006.1-2009.8:荷兰飞利浦半导体公司总部(现为NXP 半导体公司)封装研发部(IMO Back-End Innovation),任主任工程师(Principal Engineer)和资深项目主管。
  • 2004.12 起:桂林电子科技大学,教授(兼)。
  • 2004.1-2005.12:   荷兰代尔夫特理工大学精密和微系统工程系,博士后研究员(Research fellow)。
  • 1999.3-2000.3: 荷兰代尔夫特理工大学(Delft University of Technology),精密和微系统工程系, 访问学者。
  • 1989.7-1999.3: 桂林电子工业学院电子机械系。任讲师,教研室副主任。
  • 1983.7-1986.8:桂林阳朔机械厂工作,任助工/工程师。

主要荣誉

广西壮族自治区首批特聘专家(2011)

“广西高校优秀人才资助计划”人选(2007)

广西高校“八桂学者”和人才小高地“机械电子工程”创新团队负责人(2010)

广西科技进步奖二等奖(2012)
广西自然科学奖三等奖(2010)
广西高校科技进步三等奖(1997)“表面组装测试技术研究”,排名第3,     1996

广西科技进步奖三等奖“大型设备吊装钢丝受力自动监测记录系统”,排名第5, 1996

学术活动

第13届国际电子封装技术大会(the 13th International Conference on Electronic Packaging Technology and High Density Packaging) (ICEPT-HDP2012)技术委员会主席,

IEEE国际年会EuroSimE国际学术会议学术委员会委员

IEEE Electronics Packaging Technology Conference技术委员会委员

2nd International Conference on Manufacturing Science and Engineering (ICMSE 2011) 共同主席

第8--10届中国国际半导体照明论坛(CHINASSL)技术委员会委员。

国家“十二五”863计划“高效半导体照明关键材料技术研发”重大项目课题评审专家

广西照明学会理事长

中国电子学会电子制造与封装技术分会理事

教学信息

主讲课程:
微电子封装技术(双语)(本科生)
微电子制造技术概论(本科生)
工程力学(本科生)

高等工程力学(博士研究生)
现代制造工程学(硕士研究生,多教师授课)
集成电路与元器件技术(硕士研究生)

主要论文

[1]      Miao Cai, Daoguo Yang*, Kunmiao Tian,Wenbin Chen, Xianping Chen, Ping Zhang, Xuejun Fan, Guoqi Zhang, A Hybrid Prediction Method on Luminous Flux Maintenance of High-Power LED Lamps, Applied Thermal Engineering, 95 (2016) , pp:482–490. 2016. (SCI收录, IF: 2.739,中科院SCI分区大类学科2区)

[2]      Zhe Li, Daoguo Yang*, Weidong Hao, Tiecheng Wu, Song Wu, Xiaoping Li, A novel technique for micro-hole forming on skull with the assistance of ultrasonic vibration, Journal of the Mechanical Behavior of Biomedical Materials, Volume 57, April 2016, Pages 1-13.

[3]      Miao Cai, Daoguo Yang*, Xianping Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectronics Reliability, 55 (2015) pp. 1784-1789. (SCI 收录)

[4]      Jianlin Huang, Golubovic, D.S.; Sau Koh; Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang, “Rapid degradation of mid-power white-light LEDs in saturated moisture conditions,” IEEE Transactions on Device and Materials Reliability, Volume: 15, Issue: 4, 2015, pp: 478 - 485. (SCI收录)

[5]  Jianlin Huang, D. S. Golubovic, Sau Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, G.Q. Zhang, “Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests,”  Microelectronics Reliability,55 (2015) , pp: 2654–2662. (SCI收录)

[6]  Miao Cai, Daoguo Yang, Xianping Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectronics Reliability, 55 (2015) pp. 1784-1789. (SCI 收录)

[7]  Zaifu Cui, Miao Cai, Xianping Chen, Daoguo Yang, et al. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 55 (2015) pp. 1877-1881. (SCI收录, SCI收录, IF: 1.433)

[8]  J. Huang, D. S. Golubovic, S. Koh, D. Yang(杨道国), X. Li, X. Fan, and G. Zhang, “Degradation modeling of mid-power white-light LEDs by using Wiener process,” Optics express, vol. 23, no. 15, pp. A966-A978, 2015. (SCI收录)

[9]  Jianlin Huang, Dusan S. Golubovic, Sau Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang, “Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions,” IEEE Transactions on Device and Materials Reliability, Vol. 15, No. 2,  2015, pp. 220-228. (SCI收录)

[10]  Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Daoguo Yang, Genetic Algorithm (GA)-Based Inclinometer Layout Optimization, Sensors, 2015, 15(4), 9136-9155 (SCI收录, SCI: 000354236100108, IF 2.245)

[11]  Ning Yang, Xianping Chen, Tianling Ren, Ping Zhang, Daoguo Yang, “Carbon nanotube based biosensors,” Sensors and Actuators B: Chemical, vol. 207 pp. 690–715, Oct. 2015. (SCI收录, IF: 4.097, 2014中科院SCI分区大类学科2区)

[12]  X.P. Chen , N. Yang, J.K. Jiang, Q.H. Liang, D.G. Yang, G.Q. Zhang, and T.L. Ren, “Ab initio study of temperature, humidity and covalent functionalization induced band gap change of single-walled carbon nanotubes,” IEEE Electron Device Letters, vol. 36(6), pp. 606–608, Jun. 2015. (SCI收录, IF: 2.754,2014中科院SCI分区大类学科2区)

[13]  X. P. Chen, J. K. Jiang, Q. H. Liang, N. Yang, H. Y. Ye, M. Cai, L. Shen, D. G. Yang , T. L. Ren, “First-principles study of the effect of functional groups on polyaniline backbone,” Scientific Reports, vol. 5, pp: 1690-7, 2015. (SCI收录, IF: 5.578,2014中科院SCI分区大类学科2区)

[14]  Ping Zhang, Jianhua Zeng, Xianping Chen, Miao Cai, Jing Xiao, DaoGuo Yang. An Experimental Investigation of a 100 W High-power LEDs Array Using Vapor Chamber-based Plate, Advances in Mechanical Engineering, 2015, Vol. 7(11) 1–7. (SCI收录)

[15]      X. P. Li, Q. Xia, D. Qu, T. C. Wu, D. G. Yang, W. D. Hao, X. Jiang & X. M. Li,The Dynamic Dielectric at a Brain Functional Site and an EM Wave Approach to Functional Brain Imaging,Scientific Reports, 2014, vol. 4, pp:6893-6893. (SCI 收录, IF: 5.578)

[16]      M. Cai, D. J. Xie, W. B. Chen, B.Y. Wu, D. G. Yang, G. Q. Zhang. A Novel Soldering Method to Evaluate PCB Pad Cratering for Pin-Pull Testing, Microelectronics Reliability, 53, pp1568–1574, 2013. (SCI 收录, IF: 1.433) 

[17]      Yang, D.G., K.M.B. Jansen, L.G. Wang, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, X.J. Fan, “Micromechanical modelling of stress evolution induced during cure in a particle-filled electronic packaging polymer”, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 4, pp: 676-683, 2004.  (SCI 收录)

[18]      Yang, D. G., J. S. Liang, Q. Y. Li, L. J. Ernst and G. Q. Zhang, “Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach”, Microelectronics Reliability, Vol. 44, No. 12, 2004, pp: 1947-1955.  (SCI 收录)

[19]      Yang, D.G., G.Q. Zhang, L.J. Ernst, C. van't Hof, J.F.J. Caers, H.J.L. Bressers, J. Janssen, “Investigation on Flip Chip Solder Joint Fatigue with Cure-Dependent Underfill Properties,” IEEE Transactions on Components and Packaging Technologies, Vol.26, No. 2, pp: 388-398, 2003.  (SCI 收录)

[20]  Yang, D.G., Wan, F.F., Shou, Z.Y., van Driel, W.D., Scholten, H., Goumans, L., Faria, R, Effect of high temperature aging on reliability of automotive electronics,Microelectronics Reliability,2011,51: 1938-1942。(SCI收录)

[21]  Yang, Daoguo, Kengen, Martien, Peels, W. G. M., Heyes, David, van Driel, W. D., Reliability modeling on a MOSFET power package based on embedded die technology,   Microelectronics Reliability, 50(7), pp 923-927, 2010/7 (SCI收录). 

[22]  Yang, D.G., K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers and J.H.J. Janssen, “Effect of filler concentration of rubbery shear and bulk modulus of moulding compounds,” Microelectronics Reliability, Vol. 47, Issues 2-3, 2007, pp: 233-239.  (SCI 收录)

[23]  Yang, D.G., K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers and J.H.J. Janssen, “Numerical modelling of warpage induced in QFN array moulding process,” Microelectronics Reliability, Vol. 47, Issues 2-3, 2007, pp: 310-318.  (SCI 收录)

[24]  Yang, D.G., L.J. Ernst, C. van ‘t Hof, J. Bisschop, J. Janssen, F. Kuper, Z. N. Liang , R. Schravendeel, G.Q. Zhang,  “Vertical die crack stresses of Flip Chip induced in major package assembly processes,” Microelectronics Reliability,  Vol.40, (2000), pp. 1533-1538.  (SCI 收录)

[25]  Hochstenbach, P.H., W.D. van Driel, D.G. Yang, J.J.M. Zaal, E. Bagerman, “Design for Reliability Using a New Wafer Level Package Structure”, Microelectronics Reliability, in press.

[26]  W.D. van Driel, D.G. Yang, and G.Q. Zhang, “On chip–package stress interaction”, Microelectronics Reliability, Vol. 48, Issues 8-9 (2008), pp: 1268-1272.  (SCI 收录)

[27]  Yang Ping, Li Zhihua, Yang Daoguo, Parametric matching selection approach for Satellite Gear Mechanism, International Journal of Product Development 2008 - Vol. 6,  No.1  pp. 23 – 35.   (SCI 收录)

[28]  van Driel, W.D., O. van der Sluis, D.G. Yang, R. Ubachs, C. Zenz, G. Aflenzer, G.Q. Zhang, “Reliability Modelling for Packages in Flexible End-Products”, Microelectronics Reliability, Vol. 46 (2006), pp. 1880-1885.  (SCI 收录)

[29]  W.D. van Driel, D.G. Yang, C. A. Yuan, M. van Kleef, G.Q. Zhang, Mechanical Reliability Challenges for MEMS Packages: Capping, Microelectronics Reliability, Vol. 47 (2007), pp: 1823-1826.   (SCI 收录)

[30]  van’t Hof, C. , K.M.B. Jansen, G. Wisse, L.J. Ernst, D.G. Yang, G.Q. Zhang and H.J.L. Bressers, “Novel shear tools for viscoelastic characterization of packaging polymers,”  Microelectronics Reliability, Vol. 47, Issues 2-3, 2007, pp: 240-247.  (SCI 收录)

[31]  Yang, P., Liao, N.B., and Daoguo Yang,  “Property simulation for nano-scale interfacial friction between two kinds of material in MEMS based on an atomistic simplified model”, International Journal of Modern Physics B, Volume 21, Issue 20, pp. 3581-3590 (2007).  (SCI 收录)

[32]  Yang Ping, Liao Ning Bo, Yang Daoguo, and L. J. Ernst, Sliding simulation for adhesion problems in micro gear trains based on an atomistic simplified model, Microsystem Technologies, Vol. 12, No. 12, 2006.  (SCI 收录)

[33]  W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, and L. J. Ernst, “Packaging Induced Die Stresses-Effect of Chip Anisotropy and Time-Dependent Behaviour of a Moulding Compound,” Journal of Electronic Packaging, Vol. 125 (4), pp. 465-629, 2003.  (SCI 收录)

[34]  Ernst, L.J., C. van ‘t Hof, D.G. Yang, M.S. Kiasat, G.Q. Zhang, H.J.L. Bressers, J.F.J. Caers, A.W.J. den Boer, J. Janssen “Mechanical modelling and characterization of the curing process of underfill materials”, Journal of Electronic Packaging, Vol.124 (2), pp: 97-105, 2002.  (SCI 收录)

[35]  Hou, Fengze, Yang, Daoguo, Zhang, Guoqi,Thermal analysis of LED lighting system with different fin heat sinks,Journal of Semiconductors, 32(1), 2011(EI)

学术著作

[1]      Daoguo Yang, “Cure-dependent viscoelastic behaviour of electronic packaging polymers--Modeling, characterization, implementation and application”, PrintPartners Ipskamp, The Netherlands, 2007, ISBN:90-9022-180-9.

[2]      W.D. van Driel, D.G. Yang, C.A. Yuan, G.Q. Zhang, Chapter 16: Industrial Applications of Moisture Related Reliability Problems in Book: " Moisture Sensitivity of Plastic Packages of IC Devices",  Editors: X.J. Fan, E. Suhir: London:Springer,  ISBN 978-1-4419-5718-4, 2010。

[3]      Ernst, L.J., Jansen, K.M.B., Yang, D.G., van’t Hof, C., Bressers, H.J.L., Janssen, J.H.J., and Zhang, G.Q., “Polymer Materials Characterization, Modelling and Application”, in book of “Micro and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging”, Volume 1 Materials Physics / Materials Mechanics. Volume 2 Physical Design / Reliability and Packaging, Suhir, Ephraim; Lee, Y.C.; Wong, C.P. (Eds.).

[4]      杨道国, 蔡苗,Chapter 15 Solid State Lighting Reliability:Components to Systems, Springer-Verlag New York Inc., ISBN 9781461430666-7,      2012。(专著)

[5]     X.P. Chen , C.K.Y. Wong, T.L. Ren, D.G. Yang, J.K. Jiang, Q.H. Liang, and G.Q. Zhang, Chapter 1 “Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors”, in book of “Molecular Modeling and Multiscaling Issues for Electronic Materials Applications(2nd Edition)”. N. Iwamoto, A. Wymyslowski, M. Yuen and H. B. Fan (Eds.). Springer, The Netherlands, 2015. ISBN:978-3-319-12861-0.(专著)

[6]     陈显平, 张平,杨道国, 檀春健. 《传感器技术》, 北京航空航天大学出版社, 2015.  ISBN: 978-7-5124-1661-1. (本科教材)

[7]     陈显平, 张平, 杨道国,周强, 蒙瑞燊.《微电子专业英语》, 北京航空航天大学出版社, 2015.  ISBN: 978-7-5124-1730-4. (本科教材)

科研项目
  1.  国家自然科学基金项目:“大功率LED 照明灯具的退化机理及系统可靠性研究”,201401-201712,项目主持人。
  2.  国家科技支撑计划重点项目: “LED光源及灯具耐候性、失效机理和可靠性研究”(批准号:2011BAE01B14),201101-201312,国拨总经费600万,子课题主持人。
  3. 国家自然科学基金项目:“电子封装聚合物的热氧化行为及其对封装器件的影响”,2015.1-201712,主要成员第二  。
  4. 广西自然科学基金重点项目“新能源汽车电子的高可靠性封装和模块化组装的若干关键技术研究”(批准号:2011GXNSFD018027),201103-201403,项目主持人。
  5. 广西教育厅重大项目:“新能源电动汽车动力系统关键技术研究”,201109-201409,项目主持人。
  6. 企业委托项目: “AFM-Based Packaging Technology for MEMS/Sensors”APC,NL,荷兰Boschman Technologies,201103-201312,   项目主持人。
  7. 广西科技开发项目:“新型贴片式导电硅胶单体连接器产品研发”,201501-201612,项目主持人。
  8.  国家自然科学基金项目:“微电子封装中的界面层裂失效和界面强度可靠性设计方法研究” (批准号:60666002), 2007.1-2009.12, ,项目主持人。
  9. 国家自然科学基金项目:“微电子芯片封装中的界面层裂机制及控制方法研究(批准号:50243018),2003.1-2003.12,项目主持人。
  10. 国家自然科学基金项目“微电子封装聚合物的热-机械疲劳损伤研究” (批准号:60166001),2002.1-2004.12,18万,项目主持人。
  11. 广西自然科学基金:“高密度微电子封装中导电胶的可靠性研究”,2002.1-2004.9,项目主持人。
  12. 教育部留学回国人员基金:“微电子封装高聚物的微观损伤行为研究”,2000.7-2001.12,项目主持人。  
  13. 企业委托项目:”大型设备吊装钢丝受力自动监测记录系统“,1995。
  14. 军事预研项目:“表面组装测试技术研究”,1993.4-1996.6,26万,主要成员第三。    

知识产权

 [1]     Daoguo Yang, W. D. van Driel, J.J.M. Zaal , “An Integrated Component And A Method of Manufacturing An Integrated                Component”(集成器件和集成器件的制造方法), 国际发明专利WO2010049837,欧洲发明专利EP 08105689.7,中国CN102196989A。

[2]     杨道国,蔡苗,“一种基于人工神经网络的微电子封装器件的优化设计方法”,中国发明专利,专利号:ZL200810073685.7. 

[3]      杨道国,蔡苗,陈文彬等,基于步进应力的LED灯具的加速退化试验方法,中国发明专利, 2015授权,专利号:ZL201310219602.1。

[4]      蔡苗,杨道国等,一种评价PCB焊盘粘结强度的拉拔测试装置,实用新型专利,2014,专利号:ZL201420480750.9;

[5]      蔡苗,杨道国,黄月,张平,陈显平,一种无外伸引脚贴片式硅胶弹性按键,实用新型,2015,授权专利号:ZL201520331649.1;

[6]      张茂芬,蔡苗,杨道国等,一种蜂窝结构水冷散热器,实用新型,2015,授权专利号:ZL201520246407.2.

[7]      蔡苗,杨道国,张平,陈文彬,王林根,一种引线框架式大功率LED光源模组,实用新型专利,2014,专利号:ZL201420483841.8;

[8]      蔡苗,杨道国,陈文彬等,大型LED灯具系统的水冷装置,实用新型专利,中国,2012,专利号:ZL201120561728.3;

[9]      蔡苗,杨道国,陈薪宇,一种无声鼠标,实用新型专利,2014,专利号:ZL201420527686.5;

[10]  苏律铭,蔡苗,陈文彬,杨道国,一体化小型自动洗手机,实用新型专利,2014,专利号:ZL201420133730.4;

[11]  张平, 杨道国, 陈显平, 蔡苗. 一种持续稳定的高精度真空压力加载装置,实用新型专利,2015,专利号:ZL 201420655332.9;

联系信息

E-mail:    daoguo_yang@163.com; d.g.yang@guet.edu.cn

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